Dumping live SMBIOS data!
  BIOS Info: #0
    Size: 0x00018
    Vendor: "LENOVO"
    Version: "3.40"
    Date: "08/07/2012"
    Start Address: 0xf0000
    ROM Size: 8192 kB
    Features: 0x0d03000000010801da80
      PCI supported
      PnP supported
      BIOS flashable
      BIOS shadowing allowed
      ESCD supported
      CD boot supported
      Selectable boot supported
      8042 Keyboard Services supported
      ACPI supported
      USB Legacy supported
      BIOS Boot Spec supported
  System Info: #1
    Manufacturer: "LENOVO"
    Product: "04411MU"
    Version: "Lenovo ThinkServer TS430"
    Serial: "MJWGEXY"
    UUID: f15abc342b905ca2e2117a194806c42a
    Wake-up: 0x06 (Power Switch)
  Board Info: #2
    Manufacturer: "LENOVO"
    Product: "GA-6UASV3"
    Version: "N/A"
    Asset Tag: "FFFFFFFFFFFFFFFFFFFFFFFFFFFFFFFF"
    Type: 0x0a (Motherboard)
    Features: 0x09
      Hosting Board
      Replaceable
    Location: "Null"
    Chassis: #3
  Chassis Info: #3
    Manufacturer: "LENOVO"
    Version: "N/A"
    Serial: "N/A"
    Type: 0x07 (Tower)
    Bootup State: 0x03 (Safe)
    Power Supply State: 0x03 (Safe)
    Thermal State: 0x03 (Safe)
    Security Status: 0x03 (None)
  Cache Info: #4
    Designation: "L1 Cache"
    Level: L1
    State: Enabled
    Mode: 0x00 (Write Through)
    Location: 0x00 (Internal, Not Socketed)
    ECC: 0x04 (Parity)
    Type: 0x04 (Data)
    Associativity: 0x07 (8-way Set-Associative)
    Max. Size: 256 kB
    Current Size: 256 kB
    Supported SRAM Types: 0x0002 (Unknown)
    Current SRAM Type: 0x0002 (Unknown)
  Cache Info: #5
    Designation: "L2 Cache"
    Level: L2
    State: Enabled
    Mode: 0x00 (Write Through)
    Location: 0x00 (Internal, Not Socketed)
    ECC: 0x06 (Multi-bit)
    Type: 0x05 (Unified)
    Associativity: 0x07 (8-way Set-Associative)
    Max. Size: 1024 kB
    Current Size: 1024 kB
    Supported SRAM Types: 0x0002 (Unknown)
    Current SRAM Type: 0x0002 (Unknown)
  Cache Info: #6
    Designation: "L3 Cache"
    Level: L3
    State: Enabled
    Mode: 0x01 (Write Back)
    Location: 0x00 (Internal, Not Socketed)
    ECC: 0x06 (Multi-bit)
    Type: 0x05 (Unified)
    Associativity: 0x08 (16-way Set-Associative)
    Max. Size: 8192 kB
    Current Size: 8192 kB
    Supported SRAM Types: 0x0002 (Unknown)
    Current SRAM Type: 0x0002 (Unknown)
  Physical Memory Array: #7
    Use: 0x03 (System memory)
    Location: 0x03 (Motherboard)
    Slots: 4
    Max. Size: 32 GB
    ECC: 0x05 (Single-bit)
  Port Connector: #8
    Type: 0x09 (Serial Port 16550A Compatible)
    Internal Designator: "None"
    External Designator: "COM 1"
    External Connector: 0x08 (DB-9 pin male)
  System Slot: #9
    Designation: "PCI_SLOT1"
    Type: 0x06 (PCI)
    Bus Width: 0x05 (32 bit)
    Status: 0x04 (In Use)
    Length: 0x03 (Short)
    Slot ID: 1
    Characteristics: 0x010c (3.3 V, Shared, PME#)
  System Slot: #10
    Designation: "PCIE_SLOT2"
    Type: 0xa5 (Other)
    Bus Width: 0x0a (Other)
    Status: 0x04 (In Use)
    Length: 0x03 (Short)
    Slot ID: 2
    Characteristics: 0x010c (3.3 V, Shared, PME#)
  System Slot: #11
    Designation: "PCIE_SLOT3"
    Type: 0xa5 (Other)
    Bus Width: 0x0b (Other)
    Status: 0x04 (In Use)
    Length: 0x03 (Short)
    Slot ID: 3
    Characteristics: 0x010c (3.3 V, Shared, PME#)
  System Slot: #12
    Designation: "PCIE_SLOT4"
    Type: 0xa5 (Other)
    Bus Width: 0x0d (Other)
    Status: 0x04 (In Use)
    Length: 0x04 (Long)
    Slot ID: 4
    Characteristics: 0x010c (3.3 V, Shared, PME#)
  Memory Device: #13
    Location: "DIMM A1"
    Bank: "BANK 0"
    Manufacturer: "Hynix/Hyundai"
    Serial: "16CB1E82"
    Asset Tag: "9876543210"
    Part Number: "HMT325U7BFR8C-H9"
    Memory Array: #7
    Form Factor: 0x09 (DIMM)
    Type: 0x18 (Other)
    Type Detail: 0x0080 (Synchronous)
    Data Width: 64 bits (+64 ECC bits)
    Size: 2 GB
    Speed: 1333 MHz
  Memory Device Mapping: #14
    Memory Device: #13
    Array Mapping: #20
    Interleave Pos: 1
    Interleaved Depth: 1
    Start Address: 0x00000000
    End Address: 0x80000000
  Memory Device: #15
    Location: "DIMM A2"
    Bank: "BANK 1"
    Manufacturer: "Hynix/Hyundai"
    Serial: "16BB1E7F"
    Asset Tag: "9876543210"
    Part Number: "HMT325U7BFR8C-H9"
    Memory Array: #7
    Form Factor: 0x09 (DIMM)
    Type: 0x18 (Other)
    Type Detail: 0x0080 (Synchronous)
    Data Width: 64 bits (+64 ECC bits)
    Size: 2 GB
    Speed: 1333 MHz
  Memory Device Mapping: #16
    Memory Device: #15
    Array Mapping: #20
    Interleave Pos: 1
    Interleaved Depth: 2
    Start Address: 0x0000000080000000
    End Address: 0x0000000100000000
  Memory Device: #17
    Location: "DIMM B1"
    Bank: "BANK 2"
    Manufacturer: "[Empty]"
    Serial: "[Empty]"
    Asset Tag: "9876543210"
    Part Number: "[Empty]"
    Memory Array: #7
    Form Factor: 0x09 (DIMM)
    Type: 0x02 (Unknown)
    Data Width: 0 bits
    Size: No Memory Installed
  Memory Device: #18
    Location: "DIMM B2"
    Bank: "BANK 3"
    Manufacturer: "Hynix/Hyundai"
    Serial: "391CB1CA"
    Asset Tag: "9876543210"
    Part Number: "HMT351U7CFR8C-H9"
    Memory Array: #7
    Form Factor: 0x09 (DIMM)
    Type: 0x18 (Other)
    Type Detail: 0x0080 (Synchronous)
    Data Width: 64 bits (+64 ECC bits)
    Size: 4 GB
    Speed: 1333 MHz
  Memory Device Mapping: #19
    Memory Device: #18
    Array Mapping: #20
    Interleave Pos: 2
    Interleaved Depth: 2
    Start Address: 0x0000000100000000
    End Address: 0x0000000200000000
  Memory Array Mapping: #20
    Memory Array: #7
    Partition Width: 4
    Start Address: 0x0000000000000000
    End Address: 0x0000000200000000
  Type 28 Record: #31
    Data 00: 1c 16 1f 00 01 8a 00 80 00 80 00 80 00 80 00 80
    Data 10: 28 28 28 28 28 28
    String 1: "Type 27 Associated Temperature Probe 1"
  Type 27 Record: #32
    Data 00: 1b 0f 20 00 1f 00 a3 01 27 27 27 27 27 27 01
    String 1: "Cooling Dev 1"
  Type 28 Record: #33
    Data 00: 1c 16 21 00 01 67 00 80 00 80 00 80 00 80 00 80
    Data 10: 00 00 00 00 00 80
    String 1: "Type 27 Associated Temperature Probe 2"
  Type 27 Record: #34
    Data 00: 1b 0f 22 00 21 00 63 01 00 00 00 00 00 80 01
    String 1: "Cooling Dev 2"
  Type 32 Record: #35
    Data 00: 20 14 23 00 00 00 00 00 00 00 00 00 00 00 00 00
    Data 10: 00 00 00 00
  Type 38 Record: #36
    Data 00: 26 12 24 00 01 20 20 ff a3 0c 00 00 00 00 00 00
    Data 10: 00 00
  Processor Info: #40
    Payload length: 0x2a
    Socket: "CPU 0"
    Socket Type: 0x19 (Other)
    Socket Status: Populated
    Type: 0x03 (CPU)
    Family: 0xb3 (Xeon)
    Manufacturer: "Intel(R) Corporation"
    Version: "Intel(R) Xeon(R) CPU E3-1220 V2 @ 3.10GHz"
    Asset Tag: "Fill By OEM"
    Part Number: "Fill By OEM"
    Processor ID: 0xbfebfbff000306a9
    Status: 0x01 (Enabled)
    Voltage: 4.1 V
    External Clock: 100 MHz
    Max. Speed: 3800 MHz
    Current Speed: 3100 MHz
    L1 Cache: #4
    L2 Cache: #5
    L3 Cache: #6
    Core Count: #4
    Core Enabled Count: #4
    Thread Count: #4
